Aluminum Nitride Spherical Powder

Aluminum Nitride Spherical Powder is a high-purity spherical aluminum nitride powder. It features excellent thermal conductivity, insulation and high-temperature resistance, with uniform particle size distribution and good fluidity. Widely used in high thermal conductivity ceramic substrates, electronic packaging materials, thermal interface materials and other fields, it meets the heat dissipation needs of advanced electronic devices. NexusX Advanced Materials, as a premier manufacturer and supplier of high-quality aluminum nitride products, focuses on producing high-purity aluminum nitride spherical powder for diverse application fields.

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Aluminum Nitride Spherical Powder Data Sheet

Purity:	99%-99.9%
Particle Size:	30-120 μm or customized
CAS:	24304-00-5
Melting Point:	2200℃
Boiling Point:	2249℃

Aluminum Nitride Spherical Powder Description

Aluminum Nitride Spherical Powder is a high-performance inorganic non-metallic powder with a spherical morphology and ultra-high purity. It integrates outstanding thermal conductivity (up to 320 W/(m·K)), excellent electrical insulation, and strong high-temperature resistance (stable at over 1000℃ in inert atmosphere). With uniform particle size distribution, good fluidity, and low impurity content, it’s an ideal raw material for high-end thermal management applications—such as high-thermal-conductivity ceramic substrates, advanced electronic packaging materials, and high-efficiency thermal interface materials—effectively solving heat dissipation issues of high-power electronic devices.

Aluminum Nitride Spherical Powder Specifications

Properties			Unit	Product
Properties			Unit	TA-S30	TA-S50	TA-S80	TA-S120
Particle Size		D10	μm	24.1	31.75	49.6	71.0
		D50	μm	38.3	50.75	74.7	107.5
		D90	μm	61.5	80.11	111.5	134.0
Specific Surface Area			m²/g	0.05	0.05	0.03	0.03
Moisture			%	0.08	0.07	0.06	0.02
True Density			g/cm³	3.29	3.30	3.30	3.32
Tap Density			g/cm³	2.00	2.02	2.10	2.21
Chemical Composition	O		%	1.20	1.20	1.32	1.24
	C		ppm	126	120	119	119
	Si		ppm	40	40	40	40
	Fe		ppm	20	20	20	20
	Na		ppm	15	15	15	15

Aluminum Nitride Spherical Powder SEM

Aluminum Nitride Spherical Powder Features

Superior Thermal Conductivity
Excellent Electrical Insulation
High-Temperature Resistance
Optimal Spherical Morphology
Ultra-High Purity

Aluminum Nitride Spherical Powder Applications

High-Thermal-Conductivity Ceramic Substrates: As a core raw material, it is used to manufacture ceramic substrates for high-power semiconductors (such as IGBT modules). Its excellent thermal conductivity and insulation ensure efficient heat dissipation of substrates, stabilizing the operation of semiconductor devices.
Advanced Electronic Packaging Materials: Blended with resins to prepare high-thermal-conductivity packaging composites, it is applied in packaging of 5G base station chips, automotive electronic components, and LED chips, solving heat accumulation problems in high-density packaging.
Thermal Interface Materials (TIMs): Processed into thermal conductive pastes, pads, or films, it fills micro-gaps between electronic components (e.g., CPU, GPU) and heat sinks, enhancing heat transfer efficiency and prolonging component service life.
High-Temperature Structural Components: Due to its high-temperature resistance, it is used to make high-temperature-resistant parts in aerospace, industrial furnaces, and other fields, such as heat insulation linings and high-temperature sensor casings.

Aluminum Nitride Spherical Powder Packaging

The Aluminum Nitride Spherical Powder is carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

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FAQ

What’s the edge of its spherical shape?

It has better fluidity and uniform particle size, easing processing and avoiding uneven accumulation defects.

Is it high-temperature resistant?

Yes. It stays stable above 1000℃ in inert atmospheres, fitting high-temperature scenarios.

What’s its typical thermal conductivity?

Up to 320 W/(m·K), ensuring efficient heat transfer for electronic device heat dissipation.

How aids electronic packaging?

Blended with resins, it boosts packaging materials’ thermal conductivity while keeping insulation.

What’s needed for high-end ceramic substrates?

Ultra-high purity (low impurities) and uniform spherical particles to ensure substrate performance.

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