Boron Nitride Spherical Powder

Boron Nitride Spherical Powder offers high thermal conductivity, electrical insulation, and natural lubricity. Its spherical shape ensures excellent flowability and packing density. Ideal for thermal interface materials, composites, cosmetics, and high-temperature lubricants. Stable up to 900°C in air.NexusX Advanced Materials, as a premier manufacturer and supplier of high-quality. Boron Nitride (BN) products, focuses on producing high-precision aluminum nitride silicon structural compenents through advanced technologies for diverse application fields.

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Boron Nitride Spherical Powder Data Sheet

Purity:	99% or 99.5%
Particle Size:	0.5 μm, 1-2 μm, 3-5 μm, 5-10 μm, 10-15 μm, 15-20 μm, 20-30 μm, or customized according to specific requirements.
Color:	White
Density:	1.9-2.2 g/cm³
Dielectric Constant:	4.3
Dielectric Strength:	80 kV/mm
Thermal Conductivity:	300 W/mK

Boron Nitride Spherical Powder Descriptions

Boron Nitride Spherical Powder is a high-purity ceramic powder featuring perfectly rounded particles, excellent flowability, and high packing density. It uniquely combines high thermal conductivity, electrical insulation, low dielectric constant, and natural lubricity. This powder is widely used as a thermally conductive filler in thermal interface materials (TIMs), gap fillers, encapsulants, and polymer composites. It is also ideal for cosmetic formulations, release agents, and high-temperature lubricants. Chemically inert and stable up to 900°C in air, it delivers reliable performance in applications requiring both efficient heat dissipation and electrical isolation.

Boron Nitride Spherical Powder Specifications

Product	Particle Size (D50)	Specific Surface Area	Tap Density	pH Value	Moisture	Purity
Product	μm	m²/g	g/cm³	—	%	%
HMGBN-60	60-75	≤3	≤0.5	≤10.0	≤0.15	≥99.3
HMGBN-100	95-115	≤3	≤0.5	≤10.0	≤0.15	≥99.3
HMGBNL-120	125-135	≤3	≤0.5	≤10.0	≤0.10	≥99.3
HMGBN-160	170-200	≤3	0.47-0.53	≤10.0	≤0.10	≥99.3
HMGBN-200	190-215	≤3.5	0.35-0.40	≤10.0	≤0.10	≥99.3

Boron Nitride Spherical Powder Advantages

High Thermal Conductivity – Efficiently dissipates heat, ideal for thermal management applications.
Excellent Electrical Insulation – High dielectric strength and low dielectric constant, safe for electronic devices.
Natural Lubricity – Reduces friction and wear in composites, coatings, and lubricants.
Spherical Morphology – Ensures smooth flow, high packing density, and low viscosity in liquid systems.
High Purity – Minimizes contamination in sensitive applications such as semiconductors and cosmetics.
Chemical Inertness – Resistant to most acids, alkalis, and molten metals.
High Temperature Stability – Stable up to 900°C in air, and even higher in inert atmospheres.
Soft & Non-Abrasive – Does not damage processing equipment or mixing apparatus.
Low Friction Coefficient – Enhances release properties in mold release agents and anti-sticking coatings.
Good Compatibility – Easily disperses in polymers, resins, oils, and cosmetic formulations.

Boron Nitride Spherical Powder Applications

Thermal Interface Materials (TIMs) – Used as thermally conductive filler in gap fillers, thermal pads, and thermal greases for electronics cooling.
Polymer Composites – Added to plastics, resins, and elastomers to improve thermal conductivity while maintaining electrical insulation.
5G & High-Frequency Electronics – Ideal for low dielectric constant and low loss materials in antenna substrates and printed circuit boards.
Cosmetics – Used in facial powders, foundations, and sunscreens for smooth application, soft-focus effect, and oil absorption.
High-Temperature Lubricants – Added to greases and oils for reduced friction and extended service life under extreme temperatures.
Release Agents – Applied as a mold release coating for metal casting, glass forming, and plastic molding.
Encapsulants & Potting Compounds – Enhances heat dissipation while preserving electrical isolation in power modules and LEDs.
Thermal Pastes – Serves as a white, non-conductive filler for CPU/GPU thermal pastes.
Additive Manufacturing (3D Printing) – Used in specialty filament or powder blends for printing thermally conductive parts.
Aerospace & Defense – Applied in lightweight thermal management systems and high-temperature resistant coatings.

Boron Nitride Spherical Powder Packaging

The Boron Nitride Spherical Powder is carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

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FAQ

What is Boron Nitride Spherical Powder?

Boron Nitride Spherical Powder is a high-purity ceramic powder with perfectly spherical particles, offering excellent thermal conductivity, electrical insulation, and natural lubricity.

What are the key advantages of Boron Nitride Spherical Powder?

Key advantages include high thermal conductivity, high electrical insulation, low dielectric constant, natural lubricity, excellent flowability, and high packing density.

What are the typical applications of Boron Nitride Spherical Powder?

Typical applications include thermal interface materials (TIMs), 5G high-frequency electronics packaging, cosmetics, high-temperature lubricants, release agents, and thermally conductive composites.

How does Boron Nitride Spherical Powder differ from MoAlB MAB Phase Powder?

Boron Nitride Spherical Powder is an electrical insulator, thermal conductor, and self-lubricating material, while MoAlB MAB Phase Powder is an electrically conductive ceramic with high hardness and high-temperature oxidation resistance, mainly used for structural applications

What is the maximum temperature Boron Nitride Spherical Powder can withstand?

It is stable up to 900°C in air and can withstand much higher temperatures (over 1000°C) in inert atmospheres.

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