Aluminum Nitride Powder

Aluminum Nitride Powder, a high-performance ceramic material, is manufactured using high-quality raw materials and advanced processes, resulting in high purity, uniform particle size distribution, and excellent sintering activity. It serves as a key raw material for producing high-thermal-conductivity substrates, packaging materials, and heat dissipation components. NexusX Advanced Materials, as a premier manufacturer and supplier of high-quality aluminum nitride products, focuses on producing high-purity aluminum nitride powder for diverse application fields.

Or email us at [email protected]

Aluminum Nitride Powder Data Sheet

Purity:	99%-99.9%
Particle Size:	1.0-2.0 μm, or customized
CAS:	24304-00-5
Melting Point:	2200℃
Boiling Point:	2249℃
Moh’s Hardness:	9-10
Refractive Index:	1.9-2.2

Aluminum Nitride Powder Description

Aluminum Nitride (AlN) Powder is a high-purity advanced ceramic powder featuring exceptional thermal conductivity (up to 280 W/m·K), excellent electrical insulation, strong high-temperature resistance (melting point ~2200°C), chemical stability, non-toxicity, and compatibility with most metals and ceramics. It is widely applied in electronic packaging, LED heat-dissipating substrates, semiconductor thermal management, and high-temperature structural components, effectively solving heat accumulation issues in high-power electronic devices to enhance their performance and service life.

Aluminum Nitride Powder Specifications

Item	Unit	Value
Carbon (C)	ppm	<400
Oxygen (O)	%	<0.85
Specific Surface Area	m²/g	2.0~2.4
D50	μm	1.3~1.8
Calcium (Ca)	ppm	<250
Silicon (Si)	ppm	<15
Iron (Fe)	ppm	<15

Aluminum Nitride Powder SEM

Aluminum Nitride Powder Particle Size Distribution

Aluminum Nitride Powder Applications

Electronic Packaging Field: As a core material for thermal conductive substrates of power semiconductors and chip modules, it can efficiently dissipate the heat generated by high-density components during operation, preventing performance degradation or damage of electronic components caused by high temperatures and ensuring stable operation of circuits.
LED Lighting Field: Used in manufacturing LED heat dissipation substrates, it can quickly conduct the heat released by LED chips when emitting light. This solves the problems of rapid LED light decay and short service life caused by poor thermal conductivity of traditional substrates, meeting the heat dissipation requirements of high-power LED lamps.
Semiconductor Thermal Management Field: It is made into heat dissipation gaskets and thermal interface materials for semiconductor devices, filling the gaps between semiconductors and heat dissipation structures to improve heat conduction efficiency, thus meeting the precise thermal control needs of high-performance semiconductors such as CPUs and GPUs.
High-Temperature Industrial Field: Thanks to its high-temperature resistance (melting point of approximately 2200°C) and strong chemical stability, it is used to manufacture components such as industrial furnace linings and high-temperature sensor protective casings. It can withstand high-temperature environments and is not prone to reacting with industrial media, extending the service life of equipment.
Advanced Ceramic Composite Field: Combined with other ceramic materials (such as aluminum oxide and silicon carbide), it is used to prepare composite ceramics with both high thermal conductivity and high mechanical strength. These composites are applied in scenarios such as high-temperature structural parts and precision instrument housings in the aerospace field.

Aluminum Nitride Powder Packaging

The Aluminum Nitride Powder is carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

Download

FAQ

What key properties make AlN Powder stand out?

Excellent thermal conductivity (up to 280 W/m·K), high electrical insulation, high-temperature resistance (melting point ~2200°C), non-toxicity and chemical stability.

Why is it used for thermal substrates in electronic packaging?

It conducts heat efficiently to prevent overheating and insulates electricity to avoid short circuits, meeting dual demands.

Can it be used in high-temperature industries? What for?

Yes. It’s used for industrial furnace linings and high-temperature sensor protective casings, thanks to its stability.

How does it extend LED lamp lifespan?

It quickly conducts LED chip heat, reducing working temperature and slowing light decay.

Is it used alone or with other materials? What’s the benefit of combination?

Both. Combined with ceramics (e.g., alumina), it retains high thermal conductivity and enhances mechanical strength.

Get A Quote

Request a personalized quote tailored to your specific requirements.